COPPER CLAD LAMINATING SUBSTRATE USED FOR MANUFACTURING A PCB BY COPPER DIRECT LASER METHOD, AND MANUFACTURING METHOD OF A PCB THEREWITH

摘要

PURPOSE: A copper clad laminate substrate which is used for a printed circuit board and is manufactured using a copper direct laser method and a method for manufacturing the printed circuit board are provided to solve problems of error processes in forming a core via using the copper direct laser method. CONSTITUTION: A copper clad laminate substrate(10) used for a printed circuit board comprises: a core(11) corresponding to the center of the copper clad laminate substrate; a first copper foil which is attached to one side of the core; and a second copper foil(12) which is attached to the other side of the core and has thickness which is thicker than the thickness of the first copper foil. The first copper foil is arranged to face to a laser radiation surface in forming via hole in the core using a laser process.