| 摘要 |
PURPOSE: A back-side illuminated image sensor and a method for manufacturing the same are provided to obtain a desired mechanical strength without a support plate by successively forming an epi layer and a logic circuit on a substrate. CONSTITUTION: A first substrate includes an element isolation region and a pixel region. A light sensor(120) is formed on the upper side of the first substrate. An epi layer(130) is formed on the entire surface of the first substrate on which the light sensor is formed. A read-out circuitry(150) is formed on the entire surface of the epi layer. An interlayer insulation layer(160) and a wiring(170) are is formed on the entire surface of the epi layer. A micro lens(190) is formed on the rear side of the first substrate.
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