<p>The control unit has a power semiconductor switch (2) provided on an upper side of a printed circuit board (1). A conductor rail (3) is evenly fitted on a lower side of the board, and stays in thermal and electrical contact with a heat-conducting element e.g. pin. The heat-conducting element stays in electrical contact with the semiconductor switch over an opening in the board for power supply or discharge for the semiconductor switch. A cooling element (5) is arranged on the conductor rail and stays in thermal contact with the conductor rail. A thermo-conducting insulating layer is implemented as adhesive foil and adhesive layer. An independent claim is also included for an electric control unit manufacturing method.</p>
