发明名称 |
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION |
摘要 |
PURPOSE: A positive photosensitive resin composition is provided to secure the high-sensitivity and high definition of the composition, to improve he residue elimination property, and to maintain the balance of a solid content of the composition. CONSTITUTION: A positive photosensitive resin composition contains a polybenzoxazole precursor including a recurring unit marked as chemical formula 1, a photosensitive diazoquinone compound, a silane compound, a phenol compound and a solvent. In the chemical formula 1, X1 refers to an aromatic organic group or a quadrivalent-hexavalent aliphatic organic group. X2 refers to the aromatic organic group. Y1 and Y2 are the aromatic organic group or a divalent-hexavalent aliphatic organic group, respectively. |
申请公布号 |
KR20100052358(A) |
申请公布日期 |
2010.05.19 |
申请号 |
KR20080111329 |
申请日期 |
2008.11.10 |
申请人 |
CHEIL INDUSTRIES INC. |
发明人 |
JONG, JI YOUNG;CHUNG, MIN KOOK;JUNG, DOO YOUNG;CHO, HYUN YONG;YOO, YONG SIK;LEE, JONG HWA;LEE, KIL SUNG |
分类号 |
G03F7/039 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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