PURPOSE: A light emitting diode package in which light emitting diode chips are mounted is provided to drive the package with an alternating current by forming light emitting cells which are serially connected to each other in the light emitting diode chips. CONSTITUTION: A light emitting diode chip is located on a heat sink(13). A pair of lead frames(1) are spaced apart from the heat sink. A package main body(6) fixes the heat sink and the lead frames. A part of the chip mounting region of the heat sink and a part of the lead frames are exposed to the upper side of the package main body. The bottom region(14) of the heat sink is exposed to the lower side of the package main body.
