| 摘要 |
The purpose of the present invention is to provide an interposer able to ease suitably the stress concentration at the conductor portion such a via conductor even when a semiconductor element generates heat, and an interposer in according with the present invention comprises at least one layer of an inorganic insulating layer, the first wiring formed in or on the surface of the above-described inorganic insulating layer, at least one layer of an organic insulating layer formed on the outmost layer inorganic insulating layer and on the above-described first wiring, the second wiring formed on the surface of the above-described organic insulating layer, and
a conductor portion for connecting the above-described first wiring and the above-described second wiring. |
