PRINTED CIRCUIT BOARD FOR MOUNTING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A printed circuit board(PCB) for mounting a semiconductor package is provided to prevent the generation of a solder-joint crack by forming the outer trace of a conductive circuit pattern along a conductive circuit pattern in the inner layer of the PCB. CONSTITUTION: A PCB(10) includes a resin layer(12), a conductive circuit pattern(14) and a cover coat. A ball land is formed on the outermost layer of the PCB. An outer trace(30) is expanded from the ball land to the corner of the PCB. The outer trace includes a first conductive circuit pattern(32), a first conductive via-hole(34), a second conductive circuit pattern(36), a second conductive via-hole(37) and a third conductive circuit pattern(38). The first conductive circuit pattern is expanded from the outer side ball land to the inner side ball land. The second conductive circuit pattern is connected to the first conductive via-hole.