| 摘要 |
An image sensor 1 is mounted on an element mounting part 7 formed with a member whose thermal conductivity is higher than that of an element storing part 3. Inputting and outputting pins 5 for electrically connecting the image sensor to a control circuit board 13 for controlling the image sensor are provided in a direction that does not interfere with the contact part of the element mounting part 7 and a heat absorbing mechanism 8. Thus, the thermal conductivity of the image sensor and the heat absorbing mechanism can be improved and the area of a heat absorbing part can be increased. As a result, the cooling capability of the element is increased so that the image sensor can be driven under a condition at higher speed than usual. |
