CONDENSER MICROPHONE USING THE CERAMIC PACKAGE WHOSE INSIDE IS ENCOMPASSED BY METAL OR CONDUCTIVE MATERIALS

摘要

A condenser microphone comprising a substrate disposed on a micro electro mechanical system (MEMS) microphone chip and a circuit part; a package having a ring shape disposed on the substrate with the package surrounding the MEMS microphone chip and the circuit part; an insertion part having a ring shape formed of a conductive material, the insertion part being attached to an inner wall of the package; and an upper plate completely covering the package, wherein the package or the upper plate has an acoustic hole through which sound passes.