发明名称 Cooling assembly
摘要 The arrangement has two electronic components (3) e.g. transistors, to be cooled, which are compressed against a cooling element (2) by a tensioning device i.e. metal clamp. The tensioning device has a corrugated leaf spring (1) that is arranged between the electronic components and a counter-retaining element (4) in a tensioned manner. A peak of the leaf spring lies on a side of each electronic component, which is opposite to the cooling element. The leaf spring exhibits different wave periods that are defined in a manner such that the peak lies at a center of the side of each component.
申请公布号 EP2172971(A3) 申请公布日期 2010.05.19
申请号 EP20090169318 申请日期 2009.09.03
申请人 SIEMENS AG OESTERREICH 发明人 PETRICEK, MARTIN
分类号 H01L23/40;H01L25/07 主分类号 H01L23/40
代理机构 代理人
主权项
地址