发明名称 |
Method and apparatus for stacked die package with insulated wire bonds |
摘要 |
A semiconductor package has a substrate with a plurality of contact pads. A first semiconductor die is mounted to the substrate. First wire bonds are formed between each of the center-row contact pads of the first semiconductor die and the substrate contact pads. The first wire bonds include an electrically insulative coating formed over the shaft that covers a portion of a surface of a bumped end of the first wire bonds. An epoxy material is deposited over the first semiconductor die. A second semiconductor die is mounted to the epoxy material. Second wire bonds are formed between each of the center-row contact pads of the second semiconductor die and the substrate contact pads. The second wire bonds include an electrically insulative coating formed over the shaft of the second wire bonds that covers a portion of a surface of a bumped end of the second wire bonds.
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申请公布号 |
US7718471(B1) |
申请公布日期 |
2010.05.18 |
申请号 |
US20080269798 |
申请日期 |
2008.11.12 |
申请人 |
WHITE ELECTRONIC DESIGNS CORPORATION |
发明人 |
ZACCARDI JAMES |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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