| 摘要 |
Vertical cracks Vm in the thickness direction of a mother glass substrate 10 are sequentially formed along lines to be scribed and broken, and thus main scribe lines MS are formed along the lines to be scribed and broken of the mother glass substrate 10. Then, subordinate scribe lines SS are formed along the main scribe lines MS which have been formed, at a predetermined distance from the main scribe lines MS. Thus, the mother glass substrate 10 is broken along the main scribe lines MS. In this manner, the substrate can be scribed and broken efficiently without requiring a complicated device or the like.
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