| 摘要 |
The component has an insulating layer (220) arranged on a substrate (210) silicon wafer. A conductive layer (230) is arranged on the insulating layer and comprises an electrode (233). A centrifugal mass in the form of a compensator is rotatably arranged at a distance to the conductive layer. The insulating layer comprises a hole structure with recesses (234) in a region, which is extended below the electrode. The conductive layer comprises two electrodes (231, 232), and the compensator comprises an asymmetrical form with two lever arms. An independent claim is also included for a method for manufacturing a micromechanical component. |
