OPTICAL SEMICONDUCTOR-SEALING COMPOSITION

摘要

Disclosed is a composition for sealing an optical semiconductor, which is characterized by comprising: (A) an epoxy compound; (B) a carboxylic acid anhydride curing agent; (C) a curing-accelerating agent; and (D) a surface-coated silica particle which is produced by reacting 1 g of a silica particle (D1) with 0.2 to 3 mmol of a silane coupling agent (D2) comprising a silane coupling agent (d1) having an epoxy group to coat the surface of the silica particle and ring-opening the epoxy group to convert the epoxy group into a hydroxy group, and which has an average particle diameter of 5 to 50 nm. Also disclosed is an optical semiconductor element produced by sealing an optical semiconductor with the composition.