| 摘要 |
<p>PURPOSE: A semiconductor package is provided to reduce the amount of sealing materials required by forming dummy reinforcing units to cover a semiconductor chip. CONSTITUTION: A semiconductor chip(108) is mounted on a printed circuit board(PCB)(102). A connection unit(112a) electrically connects the semiconductor chip and the PCB. The connection unit is a wire or a bump. A reinforcing unit(114) is arranged on the PCB to be spaced apart from the semiconductor chip. A sealing material(116) seals the connection material and the semiconductor chip.</p> |
