| 摘要 |
PURPOSE: An epoxy resin composition and the semiconductor device using thereof are provided to improve the reliability of a semiconductor package by enhancing the adhesion force with various lead frames. CONSTITUTION: An epoxy resin composition for encapsulating a semiconductor device contains an epoxy resin, a hardener, a curing accelerator, an inorganic filler, and an adhesion increaser. The adhesion increaser contains a triazole system compound marked as chemical formula 1, and a thiadiazole system compound marked as chemical formula 2. In the chemical formula 1, R1 is selected from the group consisting of a hydrogen atom, an amino group, a hydroxyl group, and a hydrocarbon group with the carbon number of 1~8. |
