| 摘要 |
A semiconductor package and a manufacturing method thereof are provided to reduce a manufacturing cost by excluding separate sealing or a molding process. A semiconductor package includes a transparent glass(10), a transparent film(12), a semiconductor chip(40), a wire(50), and a solder ball(60). The transparent film is attached on a bottom surface of the transparent glass. The transparent film has a film over wire property. The semiconductor chip is attached on a substrate(30). The wire connects a bonding pad of the semiconductor chip to a wire bonding region of the substrate. The solder ball is an input/output unit. The solder ball is melted to a ball land(36) formed on a bottom surface of the substrate. The transparent film having the film over wire property is attached on a whole top surface of the substrate including the semiconductor chip and the wire. |
