| 摘要 |
PURPOSE: An image sensor package is provided to reduce the size of the entire image sensor package by directly arranging an external connection terminal on a semiconductor chip in order to connect a substrate and the semiconductor chip. CONSTITUTION: A photo diode is located on the upper side of an image sensor(104). A semiconductor chip(102) includes bonding pads(106) on the edge of the image sensor. A transparent substrate(108) is attached on the image sensor. An external connection terminal(112) is attached on the bonding pads. The image sensor includes a micro lens. A connection unit(110) is interposed between the image sensor and the transparent substrate.
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