PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: An electric component embedded printed circuit board and a manufacturing method thereof are provided to reduce manufacturing costs by forming a via hole without using the laser. CONSTITUTION: An opening is formed in a supporting substrate in order to correspond to the location of an electric component(S110). A bonding layer is arranged between the supporting substrate and the electric component. The electronic component is laminated on the supporting substrate(S120). An insulating layer is laminated on the supporting substrate in order to bury the electronic component(S130). A photo-curable resin layer is formed in the opening in order to cover the electrode of the electric component. A via hole is formed in the photo-curable resin layer by irradiating light to a part of the photo-curable resin layer(S150). The via is formed by filling the conductive material in the via hole(S160). A circuit pattern is formed in order to be electrically connected to the via(S170).