| 摘要 |
A wiring board (1) with a built-in electronic component is provided with a conductor pattern layer (40); a connecting terminal (80), which is arranged on the conductor pattern layer (40) and is electrically connected to a flip-chip mounted electronic component (2); and a solder resist layer (112) formed on the conductor pattern layer (40). The solder resist layer (112) is formed at the periphery of the connecting terminal (80) on the conductor pattern layer (40), and is not formed at least on some other regions on the conductor pattern layer (40). Thus, the connecting terminal (80) is protected, and insulation between the conductors is ensured. Furthermore, since the solder resist layer (112) is not formed entirely on the conductor pattern layer (40), warpage of the substrate can be reduced. |
