SURFACE TREATMENT FOR MOLECULAR BONDING

摘要

A method of bonding a first substrate (210) on a second substrate (220) by molecular bonding, the method comprising the following steps: ° forming a layer of insulation (212) on the bonding face (210a) of the first substrate (210); ° chemical -mechanical polishing said layer of insulation (212); ° activating the bonding surface of the second substrate (220) by plasma treatment; and ° bonding together the two substrates (210, 220) by molecular bonding; the method being characterized in that it further comprises, after the chemical -mechanical polishing step and before the bonding step, a step of etching the surface (212a) of the layer of insulation (212) formed on the first substrate.