CURING ACCELERATOR FOR EPOXY RESIN COMPOSITION AND ONE-PACK TYPE THERMOSETTING EPOXY RESIN COMPOSITION
摘要
<p>A curing accelerator for epoxy resin compositions, which is used in a one-pack type epoxy resin composition having excellent storage stability and rapid curability. The curing accelerator for epoxy resin compositions contains a microcapsule type curing accelerator wherein a compound represented by formula (I) is encapsulated by a thermosetting resin. (In formula (I), R1 and R2 each represents a hydrogen atom or an alkyl group.)</p>
申请公布号
WO2010052823(A1)
申请公布日期
2010.05.14
申请号
WO2009JP04946
申请日期
2009.09.28
申请人
THE YOKOHAMA RUBBER CO., LTD.;OKUNO, TSUBASA;SATO, NAO;ISHIKAWA, KAZUNORI
