| 摘要 |
<p>Provided is a chip peeling method wherein a part of the periphery of a chip can be peeled by a large peeling force in an initial peeling stage, and a chip to be peeled can be easily peeled and taken out when the chip is slid. A chip peeling apparatus and a semiconductor device manufacturing method are also provided. A stage (16) is arranged directly below an adhesive sheet (12) having a chip (11) adhered on the upper surface. The stage (16) is provided with a fixed stage section (16b) and a movable stage section (16a). In a state where the chip (11) is supported by the movable stage section (16a), a part of the periphery of the chip (11) is protruded from the movable stage section (16a). In such protruded state, the protruding section of the chip (11) is thrust up by a protruding section (50) through the adhesive sheet (12), then, negative pressure is permitted to operate to a gap (19) below a protruding section (31) to drive the movable stage section (16a).</p> |
