| 摘要 |
<p>Provided is a chip peeling apparatus by which cracks due to a stress applied upon sliding can be reduced and a chip to be peeled can be easily peeled and taken out. In the chip peeling method, a chip (11) is peeled from an adhesive sheet (12) having a chip (11) adhered on the upper surface. The adhesive sheet (12) whereupon the chip (11) is adhered is arranged so that the chip (11) corresponds to the surface of a movable stage (17) which protrudes by a first height from a base stage (16). Then, negative pressure is introduced into a space (19) arranged between the base stage (16) and the adhesive sheet (12), the movable stage (17) is brought down to a position lower than the first height, and the movable stage (17) is slid on the base stage (16) to peel the chip (11) from the adhesive sheet (12).</p> |
