BONDING APPARATUS AND BONDING METHOD

摘要

Provided are a bonding apparatus and a bonding method wherein a constant pressurizing force can be maintained by a simple configuration, even if the position of a driving section is varied.  The bonding apparatus has: a pressurizing head (52) which urges one work (S2); a vacuum chamber (51) which hermetically closes a space wherein works (S1, S2) area bonded together by means of the pressurizing head (52); a depressurizing pump (55) which is connected to the vacuum chamber (51) and is capable of bringing the inside of the vacuum chamber into a vacuum state; a driving section (54) which is supported by the vacuum chamber (51) and applies a pressurizing force to the pressurizing head (52); a sensor (56) which detects the position of the pressurizing head (52); and a control apparatus (6) which controls a pressurizing force to be applied by means of the driving section (54) based on the pressurizing head (52) position detected by the sensor (56).