| 摘要 |
PURPOSE: A method of manufacturing an image sensor module is provided to simplify a manufacturing process by arranging a semiconductor chip having an image sensor on a printed circuit board. CONSTITUTION: A lower-part of a semiconductor chip(20) is arranged in a substrate. Connection pad(3) are formed in the substrate. Bonding pad(24) are arranged in the upper side of the semiconductor chip. Connection pads correspond to the bonding pads. The bonding pads and connection pads are connected to a conductive wire(30). The photo diode unit is formed on the upper side of the semiconductor chip. The photo diode unit is electrically connected to the bonding pads. The cover member covers the photo diode unit. The molding member(50) is formed on the substrate. The molding member surrounds the conductive wire. The molding member exposes the upper side of a cover member. The photo diode unit is exposed by removing the cover member.
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