SEMICONDUCTOR PACKAGE AND STACK PACKAGE USING THE SAME

摘要

PURPOSE: A semiconductor package and a stack package using the same are provided to reduce the whole height of a stacked package by using a center pad type semiconductor chip by using the substrate having a cavity. CONSTITUTION: A semiconductor package(100) comprises a plurality of semiconductor chips(120,130), a substrate(110), connecting members(126,136) and a sealing unit(140). Semiconductor chips are stacked in the substrate. The substrate comprises a plurality of holes. A plurality of holes are formed for the electrical contact. The connecting member interlinks each semiconductor chips and the substrate. The sealing unit covers the semiconductor chips and the connecting member. The sealing unit exposes the holes.