ELECTRONIC DEVICE MANUFACTURING METHOD AND ELECTRONIC DEVICE

摘要

Provided is an electronic device manufacturing method wherein a first terminal of a first electronic component and a second terminal of a second electronic component are bonded by using a solder and the first electronic component and the second electronic component are electrically connected.  The method has a step wherein a resin layer having flux effects is arranged between the first terminal and the second terminal and a laminated body which includes the first electronic component, the second electronic component and the resin layer is obtained, a solder bonding step wherein the first terminal and the second terminal are bonded with the solder, and a pressurizing curing step wherein the resin layer is cured while pressurizing the laminated body by means of a pressurizing fluid.