发明名称 METAL PATTERN FORMATION
摘要 A METHOD OF REPRODUCIBLY MANUFACTURING CIRCUIT CARRIERS WITH VERY FINE CIRCUIT STRUCTURES AND AN ELECTROPHORETIC VARNISH TO BE APPLIED IN THIS METHOD ARE DESCRIBED IN WHICH A DIELECTRIC SUBSTRATE COMPRISING A BASE METAL SURFACE IS PROVIDED, A VARNISH LAYER (3) IS APPLIED ONTO THE SUBSTRATE SURFACE ELECTRODEPOSITING THE ELECTROPHORETIC VARNISH, THEREAFTER THE VARNISH LAYER (3) IS ABLATED IN AT LEAST PARTS OF THE REGIONS THAT DO NOT CORRESPOND TO THE METAL PATTERN TO BE FORMED BY MEANS OF ULTRAVIOLET RADIATION (5), THE BASE METAL SURFACE BEING LAID BARE, AND FINALLY THE BARE BASE METAL SURFACE IS ETCHED.
申请公布号 MY141591(A) 申请公布日期 2010.05.14
申请号 MYPI20020636 申请日期 2002.02.25
申请人 ATOTECH DEUTSCHLAND GMBH 发明人 DR. HEINRICH MEYER;DR. UDO GRIESER
分类号 H01L21/3213;G03F1/00;H05K3/00;H05K3/06;H05K3/46 主分类号 H01L21/3213
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