| 摘要 |
<p>A multi-chip lighting module (10) is disclosed for maximizing luminous flux output and thermal management. In one embodiment, a multi-chip module device (10) comprises a substantially thermally dissipative substrate (12) with a dark insulating layer (14) deposited on a surface of the substrate (12). A plurality of light emitting devices (34) is also provided. An electrically conductive layer is applied to a surface of the substrate (12), with the conductive layer comprising a plurality of chip carrier parts each having a surface for carrying at least one of the light emitting devices (34). Each light emitting device (34) has a first and a second electrical terminal. A reflective layer (44) is also provided that at least partially covers the conductive layer.</p> |
