发明名称 APPARATUS FOR ADHERING ANISOTROPIC CONDUCTIVE FILM
摘要 <p>Provided is an apparatus for adhering an anisotropic conductive film which can flexibly cope with substrates having various shapes and sizes, even the apparatus has a small main body size, and can reduce the tact time of an adhering step by adhering the anisotropic conductive films on a plurality of areas on the substrate at the same time.  The apparatus is provided with a tape supply section (P) which supplies an anisotropic conductive tape (T) wherein a separator and an anisotropic conductive film are laminated, and a tape pressure-adhering section (Q) which presses the separator side of the anisotropic conductive tape (T) and adheres only the anisotropic conductive film on a predetermined position on a work (W).  A plurality of pressure-adhering units (Qu1, Qu2) having adhering heads (1, 1') are arranged in the adhering direction of the anisotropic conductive film, and the interval between the adhering heads (1, 1') is adjustably set.  Tape supply units (Pu1, Pu2), each of which is provided with a reel mounting section wherein a reel (R) having the anisotropic conductive tape (T) wound thereon is mounted and held, are independently arranged for the adhering heads (1, 1'), respectively.</p>
申请公布号 WO2010053081(A1) 申请公布日期 2010.05.14
申请号 WO2009JP68803 申请日期 2009.11.04
申请人 KYODO DESIGN & PLANNING CORP.;TSUDA TOYOHIKO;TEMBA TAKU;NISHIKAWA SHINICHI;GUO WEIHONG 发明人 TSUDA TOYOHIKO;TEMBA TAKU;NISHIKAWA SHINICHI;GUO WEIHONG
分类号 H05K3/32;H01L21/60;H05K3/36 主分类号 H05K3/32
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