| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor package which can freely apply design for the form or arrangement of a WLP inductor, without receiving restriction in arrangement of a pad part and contributes to further miniaturization and the like. <P>SOLUTION: A semiconductor package 1 is constructed by sequentially stacking a first conductive layer 12, a first insulating layer 15, a second conductive layer 16, a second insulating layer 17, and a third conductive layer 18 in a semiconductor substrate 11. A series of circuit has one end 12a and the other end 12b of the first electrode by the first conductive layer, a first conductive part 16a and an inductor wiring 16b by the second conductive layer, and a fourth conductive part (overpass structure part) 18a by the third first conductive layer. The circuit constitutes the inductor partα. A second electrode 12c (the other 12d) by the first conductive layer is electrically connected to a fifth conductive part 18c (a sixth conductive part 18d) by the third conductive layer, through a second conductive part 16c (a third conductive part 16d) by the second conductive layer. The fifth conductive part and a part of the sixth conductive part make a pad part 18c' (18d') of a solder bump 20c (20d). <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
