| 摘要 |
PROBLEM TO BE SOLVED: To prevent film quality and a yield from becoming worse by preventing a substrate on which a thin film is formed by using a CVD device from curving when mounted on a temperature-raised film forming plate. SOLUTION: A method of mounting the substrate on the film forming plate used for a continuous parallel flat plate type CVD device includes heating a nearly center portion of the substrate before or after mounting the substrate on the film forming plate. COPYRIGHT: (C)2010,JPO&INPIT |
