发明名称 METHOD FOR MANUFACTURING ELECTRIC SOLID DEVICE, ELECTRIC SOLID DEVICE, AND LIQUID CRYSTAL DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electric solid device by which even when an aperture pattern is formed by dry-etching an overlay conductive film on an insulating film, an insulating film with an appropriate film thickness can be left in a region overlapping the aperture pattern, and to provide an electric solid device and a liquid crystal device having the electric solid device as an element substrate. Ž<P>SOLUTION: Upon forming a light-transmitting pixel electrode 7a having a slit 7b on an insulating film 8 in the process of manufacturing an element substrate of a liquid crystal, a resist mask 96 is formed on an overlay conductive film 7 and subjected to dry etching. The insulating film 8 is formed thicker than a necessary film thickness, and a recessed portion 8a having a bottom is formed in the insulating film 8 by dry etching. Accordingly, the insulating film 8 having the required film thickness can be formed in the bottom 8b of the recessed portion 8a. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010107700(A) 申请公布日期 2010.05.13
申请号 JP20080279329 申请日期 2008.10.30
申请人 SEIKO EPSON CORP 发明人 SERA HIROSHI
分类号 G02F1/1343 主分类号 G02F1/1343
代理机构 代理人
主权项
地址