METHOD OF FORMING SOLDER BUMP USING THE FOAM TAPE

摘要

PURPOSE: A method of forming a solder bump is provided to secure the volume of a solder bump in a fine pitch by using the thickness of a foam tape. CONSTITUTION: A circuit pattern is formed on the printed circuit board. A foam tape is attached by a roller to the printed circuit board. A hole is formed in the foam tape in order to expose the circuit pattern. A smear inside the hole is removed by a desmear process. A solder paste(20) is filled in the hole of the foam tape by a squeegee(18). The solder bump is formed by a reflow process on the printed circuit board. The foam tape is removed from the printed circuit board.