| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a structure that prevents a tip of a connection tool from contacting with an edge of an opening, without enlarging an area of an electrode pad, when connecting a conductor to an external connection electrode exposed to a base of the opening as the electrode pad by using the connection tool. <P>SOLUTION: A semiconductor device includes a semiconductor element layer 7, a laminated wiring part 11 formed of a plurality of wiring layers 13, 15 and 17 and a plurality of interlayer dielectrics 12, 14, 16 and 18 on one face side of the semiconductor element layer 7, the external connection electrode 17a formed on one of a plurality of the wiring layers, and the opening 22 formed in a recess from the semiconductor element layer 7 to the laminated wiring part 11 while a surface of the external connection electrode 17a is exposed as a structure of a solid-state imaging device. The opening 22 is formed such that an opening diameter d1 far from the external connection electrode 17a becomes larger than an opening diameter d2 near the external connection electrode 17a. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
