| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently cool a light emitting device. Ž<P>SOLUTION: A plurality of light emitting elements 32 are formed in an element region A1 on an element forming plane 12 of a substrate 10, and a drive circuit 34 driving each light emitting element 32 is arranged at a mount region A2. A plurality of groove parts 40 are formed in a heat radiating plane 14 of the substrate 10 opposite to the element forming plane 12. Each groove part 40 extends in a direction of a short side 141 of a heat radiating plane 14. The plurality of groove parts 40 are distributed at both a region behind the element region A1 and a region behind the mount region A2 on the heat radiating plane 14. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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