发明名称 |
SEMICONDUCTOR-MANUFACTURING APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor-manufacturing apparatus for forming an insulation film, an electroconductive film or the like on a semiconductor substrate such as a silicon wafer, which suppresses a production of particles. Ž<P>SOLUTION: The semiconductor-manufacturing apparatus 1 for forming the film on the semiconductor substrate includes: a body 2 in which the film is formed on the semiconductor substrate; a substrate loader/unloader 3 having a waiting area at which the semiconductor substrate waits when being carried into the body 2 through a hatch or being carried out from the body 2 through the hatch 18; an opening/closing mechanism 16 which opens/closes the hatch 18; a first sensor 26 which detects the air pressure in the body 2; a second sensor 29 which detects the air pressure in the substrate loader/unloader 3; and a control section 24 which controls the opening/closing mechanism 16 based on the information sent from the first sensor 26 and the second sensor 29. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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申请公布号 |
JP2010106303(A) |
申请公布日期 |
2010.05.13 |
申请号 |
JP20080278171 |
申请日期 |
2008.10.29 |
申请人 |
TOSHIBA CORP;SANDISK CORP |
发明人 |
SATO NOBUYOSHI;HARADA YOSHIHIRO;YAMAGUCHI KATSUAKI;OKINA TERUO |
分类号 |
C23C16/52;C23C16/44;H01L21/31 |
主分类号 |
C23C16/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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