| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a sealing/filling agent for an electric/electronic component which can be sufficiently cured at room temperature and can improve reliability of an electric/electronic component, and to provide the reliable electric/electronic component. <P>SOLUTION: In the sealing/filling agent for an electric/electronic component comprising at least a two-pack type hydrosilylation reaction-curable organopolysiloxane composition, when viscosity just after mixing all components together at room temperature is made as initial viscosity, a time period required for reaching twice that of the initial viscosity at room temperature from just after the mixing is 10 minutes or more, and after reaching 5 times that of the initial viscosity, a time period required for reaching 10 times that of the initial viscosity at room temperature is 10 minutes or less. The electric/electronic component is produced by performing sealing/filling with the sealing/filling agent at room temperature. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
