| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of efficiently manufacturing a semiconductor substrate that is formed of a semiconductor layer reduced in thickness with density, smoothness, and high performance by baking a printed layer, which is provided on a base material and contains semiconductor nanoparticles, at low temperature in a short time. SOLUTION: The method of manufacturing the semiconductor substrate includes the steps of: forming the printed layer on the base material by printing a pattern of a coating solution containing the semiconductor nanoparticles; and forming the patterned semiconductor layer by baking the printed layer. The printed layer is baked by exposure to surface wave plasma generated by applying microwave energy. COPYRIGHT: (C)2010,JPO&INPIT |
