发明名称 MULTILAYER WIRING BOARD AND FOLDABLE ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a multilayer wiring board having a structure that can be easily wound in a stable state. SOLUTION: The multilayer wiring board 10 includes a flexible wiring unit 20 composed of a plurality of belt shaped flexible wiring materials which are slidably laminated on one another, and a band member 21 for packing these flexible wiring materials into a bundle. The plurality of the flexible wiring materials are firmly fixed to each other at one end and the other end in the longitudinal direction. The inside face of the band member 21 is bonded only to the surface of the outermost layer of the one of the outermost layer of these flexible wiring materials. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010109152(A) 申请公布日期 2010.05.13
申请号 JP20080279734 申请日期 2008.10.30
申请人 SUMITOMO BAKELITE CO LTD 发明人 ARAI SHINYA
分类号 H05K1/14;H05K3/46 主分类号 H05K1/14
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