| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a means to stably remove a mold release film, in a method of manufacturing a heat radiation structure wherein a mold release film is removed from a state where an electronic component and the mold release film are stuck to one surface and the other surface of a heat radiation sheet, respectively, and a heat radiation member is stuck to the other surface. <P>SOLUTION: After the electronic component 20 and the mold release film 30b are stuck to one surface and the other surface of the heat radiation sheet 20, respectively, the mold release film 30b is removed from the other surface of the heat radiation sheet 30 by setting joint force between the other surface of the heat radiation sheet 30 and the mold release film 30b smaller than that between the one surface of the heat radiation sheet 30 and the electronic component 20. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
