发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
Provided are a semiconductor package and a method of manufacturing the same. The semiconductor package includes a semiconductor chip, a transparent substrate, an adhesive pattern, and at least one dew-proofer. The semiconductor includes a pixel area. The transparent substrate is disposed on the semiconductor chip. The adhesive pattern is disposed between the semiconductor chip and the transparent substrate and provides a space on the pixel area. At least one dew-proofer is disposed between the semiconductor chip and the transparent substrate and spaced from the adhesive pattern.
|
申请公布号 |
US2010117181(A1) |
申请公布日期 |
2010.05.13 |
申请号 |
US20090617910 |
申请日期 |
2009.11.13 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM JUNG-HWAN;KANG UN-BYOUNG;YI DONG-HUN;KWON WOONSEONG;JANG HYUNG-SUN;JEON JONGKEUN;LEE YONGJIN;KIM KEESEOK |
分类号 |
H01L31/0232;H01L31/02 |
主分类号 |
H01L31/0232 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|