发明名称 METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic electronic component complying with a demand for improvement in productivity. Ž<P>SOLUTION: The method of manufacturing the ceramic electronic component formed by laminating a ceramic layer 2 and a conductive layer 3 includes the steps of: preparing ceramic paste 2a formed by mixing ceramic powder with a thermosetting or photosetting binder in a non-setting state and containing no solvent; preparing conductive paste 3a formed by mixing conductive powder with a thermosetting or photosetting binder in a non-setting state and containing no solvent; forming a laminate 4 by laminating a ceramic coating film 2b formed by applying the ceramic paste 2a and a conductive coating film 3b formed by applying the conductive paste 3a; and baking the laminate 4. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010109027(A) 申请公布日期 2010.05.13
申请号 JP20080277708 申请日期 2008.10.29
申请人 KYOCERA CORP 发明人 MOROOKA TAKAYOSHI
分类号 H01G4/12;H01G4/30 主分类号 H01G4/12
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