发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device which can comparatively easily control a work function of a gate electrode formed of metal even if heat treatment is performed after the formation of the gate electrode. Ž<P>SOLUTION: Impurities are injected into a metal film 3 for gate electrodes formed in a pFET region Rp after forming a gate insulating film 2 and the metal film 3 for gate electrodes one by one on a semiconductor substrate 1 of an nFET region Rn and pFET region Rp. By this, since the composition of the metal film 3 for gate electrodes formed in the pFET region Rp can be changed, the work function of the gate electrode of the pFET region Rp formed by the metal film 3 for gate electrodes can be changed. Therefore, the gate electrodes having different work functions can be formed easily in the nFET region Rn and the pFET region Rp. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010109214(A) 申请公布日期 2010.05.13
申请号 JP20080280836 申请日期 2008.10.31
申请人 RENESAS TECHNOLOGY CORP 发明人 HAYASHI TAKESHI;NISHIDA MASAO;YAMASHITA TOMOHIRO;YAMAMOTO YOSHIKI
分类号 H01L21/8238;H01L27/092;H01L29/423;H01L29/49;H01L29/78 主分类号 H01L21/8238
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