FUSE STRUCTURE FOR INTERGRATED CIRCUIT DEVICES

摘要

A fuse structure for an IC device and methods of fabricating the structure are provided. The fuse structure comprises a metal-containing conductive strip formed over a portion of a semiconductor substrate. A dielectric layer is formed over the semiconductor substrate, covering the conductive strip. A first interconnect and a second interconnect are formed in vias extending through the dielectric layer, each physically and electrically connecting to a part of the conductive layer. First and second wiring structures are formed over the dielectric layer in electrical contact with the first and second interconnects respectively. The contact area between one of the interconnects and the strip is chosen so that electromigration will occur when a pre-selected current is applied to the fuse structure.