发明名称 VAPOR DEPOSITION APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus which can improve the yield and the productivity of a vapor deposited film by stabilizing the evaporation amount of a vapor deposition material. SOLUTION: In the vapor deposition apparatus, a vapor deposition material 17 is vapor deposited on a lower surface of a resin film base material 12 by irradiating the vapor deposition material 17 with an electron beam 19 from an electron gun 16 while continuously transferring and winding the resin film base material 12 in a vacuum chamber 11. A moving speed control means 23 sets the moving speed of the vapor deposition material 17 by an vapor deposition material moving means 18 to a first moving speed when the value of the material temperature measured by a temperature measuring means 22 for the vapor deposition material is lower than a standard value, and sets the moving speed of the vapor deposition material 17 by the vapor deposition material moving means 18 to a second moving speed higher than the first moving speed when the value of the material temperature measured by a temperature measuring means 22 for the vapor deposition material is higher than the standard value. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010106320(A) 申请公布日期 2010.05.13
申请号 JP20080279715 申请日期 2008.10.30
申请人 TOPPAN PRINTING CO LTD 发明人 ISHII RYOJI
分类号 C23C14/24;C23C14/56 主分类号 C23C14/24
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