| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a high-quality package of WLP of high productivity. Ž<P>SOLUTION: A method of fabricating a package of a semiconductor wafer includes a dam formation step for forming a flow preventing dam 41 of an insulating layer, on an edge of the semiconductor wafer or on the periphery of an alignment mark 11; an insulating layer formation step for forming an insulating layer 23 on a passivation layer 22; a metal joint formation step for forming a metal joint 26 by using the alignment mark 11; and a wiring formation step for forming a wiring layer 24 by using the alignment mark 11. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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