发明名称 PREPARATION METHOD OF ELECTROCONDUCTIVE COPPER PATTERNING LAYER AND COPPER PATTERNING LAYER FORMED THEREFROM
摘要 PURPOSE: A manufacturing method of an electro-conductive copper pattern layer, and a copper pattern layer formed therefrom are provided to form a copper pattern layer without preparing a space to maintain an inert gas atmosphere. CONSTITUTION: A manufacturing method of an electro-conductive copper pattern layer comprises the following steps: preparing a reducing agent containing copper dispersion solution by mixing a copper group particle and a reducing agent; forming a reducing agent containing copper group particle pattern layer by printing or filling the dispersion solution to a base material with a constant shape; and plasticizing the pattern layer among air. The copper group particle is selected form the group consisting of a copper particle, a cuprous oxide particle and their mixture.
申请公布号 KR20100050408(A) 申请公布日期 2010.05.13
申请号 KR20090104452 申请日期 2009.10.30
申请人 LG CHEM. LTD. 发明人 KIM, SO WON;LEE, WOO RAM;KIM, SANG HO
分类号 H01B1/22;H01L21/28 主分类号 H01B1/22
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