发明名称 |
PREPARATION METHOD OF ELECTROCONDUCTIVE COPPER PATTERNING LAYER AND COPPER PATTERNING LAYER FORMED THEREFROM |
摘要 |
PURPOSE: A manufacturing method of an electro-conductive copper pattern layer, and a copper pattern layer formed therefrom are provided to form a copper pattern layer without preparing a space to maintain an inert gas atmosphere. CONSTITUTION: A manufacturing method of an electro-conductive copper pattern layer comprises the following steps: preparing a reducing agent containing copper dispersion solution by mixing a copper group particle and a reducing agent; forming a reducing agent containing copper group particle pattern layer by printing or filling the dispersion solution to a base material with a constant shape; and plasticizing the pattern layer among air. The copper group particle is selected form the group consisting of a copper particle, a cuprous oxide particle and their mixture.
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申请公布号 |
KR20100050408(A) |
申请公布日期 |
2010.05.13 |
申请号 |
KR20090104452 |
申请日期 |
2009.10.30 |
申请人 |
LG CHEM. LTD. |
发明人 |
KIM, SO WON;LEE, WOO RAM;KIM, SANG HO |
分类号 |
H01B1/22;H01L21/28 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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