COPPER CONDUCTIVE PASTE TO BE FILLED IN THROUGH-HOLE, METHOD OF MANUFACTURING SUBSTRATE WITH COPPER CONDUCTOR FILLED IN THROUGH-HOLE, SUBSTRATE WITH COPPER CONDUCTOR FILLED IN THROUGH-HOLE, CIRCUIT BOARD, ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a copper conductive paste to be filled in through-holes for preventing the fall-off or continuity failure of a copper conductor by reducing the occurrence of shrinkage when filled in the through-holes and fired. SOLUTION: The copper conductive paste to be filled in the through-holes is of such a type that it is filled in the through-holes of a heat resistant substrate and fired under a non-oxidizing atmosphere. It has a volume change rate of 8% or lower during firing, wherein the copper conductor has an electric resistivity of 10μΩcm or smaller after firing. It contains at least copper powder, glass powder, and organic vehicle. The copper powder is a mixed powder consisting of one having particle sizes of smaller than 1μm and accounting for 10-30 mass% and one having particle sizes of 1-50μm and accounting for 70-90 mass%. It has a tap density of 6.0 g/cc or more. The copper conductive paste contains organic components accounting for 8.5 mass% or less. COPYRIGHT: (C)2010,JPO&INPIT